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2013 05 ÀÚȸ»ç Çϳª½Ç¸®ÄÜ, Çϳª¸ÓƼ¸®¾óÁî·Î »ç¸í º¯°æ
09 ±¹°¡»ý»ê¼º´ë»ó ±¹¹«ÃѸ®Ç¥Ã¢ ¼ö»ó
10 ºê¶óÁú HT¸¶ÀÌÅ©·Ð Ŭ¸°·ë ¿Ï°ø
2012 04 World Class 300 ±â¾÷ ¼±Á¤ (Áö½Ä°æÁ¦ºÎ)
06 À¯¿¬ ½Ç¸®ÄÜ ¸Þ¸ð¸® ÆÐŰ¡ °øÁ¤±â¼ú °³¹ß
11 Global Standard ±â¼ú°æ¿µ´ë»ó 5³â¿¬¼Ó ¼ö»ó (¸í¿¹ÀÇ Àü´ç Çå¾×)
2011 05 Çѱ¹Àå¾ÖÀΰí¿ë°ø´Ü ¾÷¹«Çù¾à MOU ü°á
05 ºê¶óÁú Åë½ÅºÎÀå°ü ¹æ¹®
06 ºê¶óÁú ÁÖÁö»ç ¹æ¹® (Rio Grande do sul ÁÖ)
08 SAP ERP ½Ã½ºÅÛ µµÀÔ
09 Àå¾ÖÀΰí¿ëÃËÁøºÎ¹® ´ëÅë·Éǥâ
09 2011³â ⸳ 10Áֳ⠱â³ä½Ä
12 HT Micron (Brazil) ¸Þ¸ð¸®¸ðµâ ù »ý»ê
2010 01 Çϳª¸¶ÀÌÅ©·Ð RFID ¹Ì±¹ USDA ÀÎÁõȹµæ
02 HILA (HANA INNOSYS Latin Armerica) ¼³¸³
03 Çϳª¸¶ÀÌÅ©·Ð ºê¶óÁú¹ýÀÎ (HT Micron) ÃâÀÚ
05 Global Standard ±â¼ú°æ¿µ´ë»ó 3³â¿¬¼Ó ¼ö»ó
06 Áö½Ä°æÁ¦ºÎ ±¹Ã¥°úÁ¦ ÁÖ°ü±â°ü ¼±Á¤
(Â÷¼¼´ë ÃʹÚÇü MCP Àμâȸ·Î±âÆÇ ¸ðµâ ¹× ÀÓº£µðµå PCB ¸ðµâ °³¹ß)
06 ÇϳªºÀ»ç´Ü â´Ü
08 Cu OSP Process °³¹ß
10 POP ƯÇã Ãâ¿ø
10 º»»ç 3¶óÀÎ ÁØ°ø
11 ºê¶óÁú °úÇбâ¼úºÎ Àå°ü ¹æ¹®
2009 01 Probe Tester µµÀÔ
01 ¼¼°èÃÖÃÊ 8´Ü ÀûÃþ SIP(System in package) Type USB Flash Drive »ó¿ëÈ
02 SSD Ãâ½Ã
03 ³³¼¼ÀÚÀÇ ³¯ ±¹¼¼Ã»Àå ǥâ
06 Çϳª½Ç¸®ÄÜ¢ß ±¹³»ÃÖÃÊ 420mm ´Ü°áÁ¤ ½Ç¸®ÄÜÀ×°÷ °³¹ß
09 ¹Ì±¹ MEMC 2¹é¸¸ºÒ ÅõÀÚÀ¯Ä¡ (Çϳª½Ç¸®ÄÜ)
09 ¹Ì±¹ Fusion-IO¿Í SSD Á¦Ç° µ¶Á¡ °ø±Þ °è¾à
12 ÀÚ»ç MCP(Multi Chip Package) Memory+Memory Package °³¹ß
12 Áö½Ä°æÁ¦ºÎ ±¹Ã¥°úÁ¦ ÁÖ°ü±â°ü ¼±Á¤ (e-MMCÀÇ ÄÁÆ®·Ñ·¯ ¹× Á¦Ç°°³¹ß)
2008 01 RFID Tag 1Â÷ Sample °³¹ß
02 ¸ÂÃãÇü °è¾àÇаú ¼³¸³ (È£¼´ë ¹ÝµµÃ¼°øÇÐ»ç °úÁ¤)
04 RF Tester µµÀÔ
05 MCP (2,3stack) ¾ç»ê °³½Ã
05 SIP ƯÇã ȹµæ
05 Global Standard ±â¼ú°æ¿µ´ë»ó 2³â¿¬¼Ó ¼ö»ó
09 Çѱ¹»ý»ê¼ºº»ºÎ ±¹°¡»ý»ê¼º Çõ½Å´ë»ó ¼ö»ó
11 HMAÀÇ SI »ç¾÷ ½ÃÀÛ
2007 01 Çϳª½Ç¸®ÄÜ(ÁÖ) ¼³¸³
04 SiP (System in Package) ¾ç»ê ¼º°ø
05 Global Standard ±â¼ú°æ¿µ´ë»ó ¼ö»ó
06 High Density& Low cost FBGA/MCP Package°³¹ß
11 Thermally Enhanced & Wide QFN Package°³¹ß
12 RFID Tag °³¹ß ½ÃÀÛ
12 ¾Æ¸§´Ù¿î °ü¼¼ÇàÁ¤ ÆÄÆ®³Ê ¼±Á¤
2006 03 ISO/TS16949 ÀÎÁõȹµæ
04 BGA MCP (Multi Chip Package) Process °³¹ß
04 º¥Ã³ 1õ¾ï Ŭ·´ µîÀç
05 KDB Global Star ¼±Á¤
07 FBGA SD4(Low profile Fine pitch FBA 4 Stack Die) 1.2mm T Package°³¹ß
07 Korea Fast Technology 50 ±â¾÷ 2³â ¿¬¼Ó ¼±Á¤
10 ½Å TPM KICK-OFF
11 Çѱ¹Ç¥ÁØÇùȸ ¼±Á¤ Ç°Áú°æÀï·Â ¿ì¼ö ±â¾÷ ¼±Á¤
12 1¾ïºÒ ¼öÃâÀÇ Å¾ ¼ö»ó
12 Ãæû°í¿ë´ë»ó ¼ö»ó
12 Micro USB °³¹ß
2005 01 HYNIX ÃÖ¿ì¼ö °ø±Þ¾÷ü»ó ¼ö»ó
05 Á¦12ȸ Ãæû³²µµ ±â¾÷´ëȸ Á¾ÇÕ´ë»ó ¼ö»ó
06 Çϳª¸¶ÀÌÅ©·Ð Á¦2»ç¾÷Àå (Çö º»»ç) ÁØ°ø
07 Korea Fast Technology 50±â¾÷ ¼±Á¤
10 ÄÚ½º´Ú »óÀå
10 DRAM Face Down FBGA (BOC) Package °³¹ß
10 LFBGA SD4(Low profile Fine pitch FBA 4 Stack Die) Package°³¹ß
11 7õ¸¸ºÒ ¼öÃâÀÇ Å¾ ¼ö»ó
12 ³ë»ç¹®È´ë»ó ±¹¹«ÃѸ®»ó ¼ö»ó
12 SiP (System in Package) Process °³¹ß
2004 02 ISO 14001 ÀÎÁõȹµæ
03 Áß¼Ò±â¾÷ÃÖÃÊ »ç³»´ëÇÐ °³¼³
03 »ï¼ºÀüÀÚ ¿ì¼ö °ø±Þ¾÷ü»ó ¼ö»ó
11 5õ¸¸ºÒ ¼öÃâÀÇ Å¾ ¼ö»ó / ´ëÇ¥ÀÌ»ç ÀºÅ¾»ê¾÷ÈÆÀå ¼ö»ó
12 FBGA(Ball Grid Array) Package Process °³¹ß
12 µðÁöÅÐ º»ºÎ 2004³â ¸ÅÃâ ´Þ¼º
2003 02 ¹Ì±¹ ¹ýÀÎ ¼³¸³
06 ¼ºÁøÀüÀÚ¿Í ÇÕº´ (Á¶¸³,°Ë»ç ÀÏ°ý »ý»êüÁ¦ ±¸Ãà)
11 OLED µð½ºÇ÷¹ÀÌ ÆгΠ±¸µ¿ÀåÄ¡ ƯÇã Ãâ¿ø
11 2õ¸¸ºÒ ¼öÃâÀÇ Å¾ ¼ö»ó
12 AXIS(USB Flash Drive) ¼°æÈ÷Æ®»óÇ°¼±Á¤
2002 08 Hana Mobile Disk ½Ç¿ë½Å¾Èµî·Ï (ÀÏüÇü ȸÀüµ¤°³)
09 ISO 9001 ÀÎÁõȹµæ
2001 08 ȸ»ç¼³¸³