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¸ðÁý ºÎ¹® ÅÃ1 ¡Û Analog & BCD ´ã´ç¾÷¹« - Analog & BCD ¼ÒÀÚ °³¹ß - CMOS/BJT/DEMOS/LDMOS/Passives ¼ÒÀÚ Æ¯¼º Æò°¡ ¹× ºÐ¼® - Module Process set-up ¹× Full Process Integration - Test Pattern (TEG) Á¦ÀÛ ¹× ¼ÒÀÚ characterization - Design Rule doc. ¹× PDK deliverables Á¦ÀÛ ÀÚ°Ý¿ä°Ç [Çʼö] - Analog & BCD ¼ÒÀÚ°³¹ß °æ·Â 2³â ÀÌ»ó(¼®»ç), 4³â ÀÌ»ó(Çлç) [¿ì´ë] - TCAD Simulation tool È°¿ë ¼÷·ÃÀÚ ¡Û LV/MV MOSFET ´ã´ç¾÷¹« - LV/MV MOSFET Cell & Ring Design - Test pattern ¼³°è ¹× Layout - Trench Gate Module Process set-up ¹× Full Process Integration - Static & Dynamic Test ¹× Characterization ÀÚ°Ý¿ä°Ç [Çʼö] - PowerDevice/Á¦Ç°°³¹ß °æ·Â 3³â ÀÌ»ó(¼®»ç), 5³â ÀÌ»ó(Çлç) - TCAD »ç¿ë °¡´ÉÀÚ [¿ì´ë] - Data-sheet Á¦ÀÛ ¹× Board ½ÇÀå Test À¯°æÇèÀÚ |
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