[´ë±â¾÷ ¹ÝµµÃ¼È¸»ç]
Foundry Customer Engineering
´ã´ç¾÷¹« | ÀÚ°Ý¿ä°Ç | Àοø |
---|---|---|
[´ã´ç¾÷¹«] - Áß±¹ Fabless °í°´ ´ë»ó Technology Promotion - °í°¹ EngageºÎÅÍ Á¦Ç°¼³°è±îÁö ¸ðµç ´Ü°è¿¡¼ ±â¼úÀûÀÎ »çÇ×À» °ü¸®ÇÏ°í °í°´°ú Ä¿¹Â´ÏÄÉÀÌ¼Ç [±Ù¹«ºÎ¼ ¹× Á÷±Þ/Á÷Ã¥]
|
[ÀÚ°Ý¿ä°Ç] - ÇзÂ: ÇлçÀÌ»ó - ÀüÀÚ/ÈÇÐ/¹°¸®/Àç·á µî ¹ÝµµÃ¼ °ü·Ã Àü°ø- ÇöÁöÀÎ ¼öÁØÀÇ À¯Ã¢ÇÑ Áß±¹¾î (¸»Çϱâ/¹®¼ÀÛ¼º) [¿ì´ë»çÇ×] - Fab Process À¯°æÇèÀÚ (°³¹ß/PI or Module Process) - BCD Process À¯°æÇèÀÚ - ÇØ¿Ü ±Ù¹« À¯°æÇèÀÚ - Power IC ¼³°è ¹× Application À¯°æÇèÀÚ - ¿µ¾î Speaking °¡´É
[±Ù¹«Áö] °æ±â ºÎõ½Ã
|
1 ¸í |
±Ù¹«Á¶°Ç
ÀüÇü´Ü°è ¹× Á¦Ãâ¼·ù
Á¢¼ö¹æ¹ý
2024³â 12¿ù 10ÀÏ ~ ä¿ë½Ã ¸¶°¨
±âŸ À¯ÀÇ»çÇ×