[Á÷¹«³»¿ë]
¡º2025. 04¿ù ¼ö¿ø½Ã ÀÏÀÚ¸®¹Ú¶÷ȸ¡» ? ÀÏ ½Ã : 2025. 4. 9 (¼ö) 14:00 ~ 17:00 [3½Ã°£]? Àå ¼Ò : ¼ö¿øÄÁº¥¼Ç¼¾ÅÍ Àü½ÃȦ 3(1Ãþ)(¼ö¿ø½Ã ¿µÅ뱸 ±¤±³Áß¾Ó·Î 140)? Áغñ¹° : À̷¼, ÀÚ±â¼Ò°³¼ ? ¹® ÀÇ : ¢Ï
***-****-****=========================* Hardware engineer(1¸í)- AP(Application Processor) ±â¹ÝÀÇ Embedded Board°³¹ß- °¢Á¾ Interface ¹× Peripheral¿¡ ´ëÇÑ ÃæºÐÇÑ ÀÌÇØ ¹× ¼³°è- OrCAD¸¦ ÀÌ¿ëÇÑ È¸·Î¼³°è- PADS, Allegro tool »ç¿ëÇÑ ¼³°è- Chip°³¹ß¿¡ µû¸¥ Bring-Up Board°³¹ß - ¿ÜÁÖ ¾÷ü °ü¸®* TEST engineer(1¸í)- ATEÀåºñ(Teradyne FLEX, Advantest 93K)À¯°æÇèÀÚ- Programming language¼÷·ÃÀÚ(Á¾·ùºÒ¹®)- ¿©·¯ device/application Å×½ºÆ® ¼Â¾÷ °æÇèÀÚ* Package Simulation engineer(1¸í)- Package design ÃÖÀûȸ¦ À§ÇÑ SI/PI Simulation ¹× Çؼ®(High Speed I/O(DDR, PCIe, SERDES, USB etc) SI/PI Simulation)- System analsys, Package Design GuideµµÃâ ¹× Á¦°ø- SI SimulationÀ» ÅëÇÑ Package substrate Review ¹× °í°´»ç Áö¿ø- PKG Design reveiw °æ·Â - ÇлçÀÌ»ó(°æ·Â5³âÀÌ»ó)
[±Ù¹«½Ã°£ ¹× ÇüÅÂ]
ÁÖ 5ÀÏ ±Ù¹«
(±Ù¹«½Ã°£) (¿ÀÀü) 9½Ã 00ºÐ ~ (¿ÀÈÄ) 6½Ã 00ºÐ
ÁÖ¼ÒÁ¤±Ù·Î½Ã°£ : 40½Ã°£
[±Þ¿©Á¶°Ç]
- ¿¬ºÀ
45000000¿ø ÀÌ»ó
- »ó¿©±Ý : 0%
(¹Ì Æ÷ÇÔ)
- ¸éÁ¢ ÈÄ °áÁ¤ °¡´É
¿ì´ëÁ¶°Ç : ¿îÀü¸éÇãÁõ
[Àå¾ÖÀÎä¿ëÈñ¸Á¿©ºÎ]
Àå¾ÖÀÎ º´Çàä¿ë(Àå¾ÖÀÎ ¿ì´ë)
[º´¿ªÆ¯·Ê]
- ºñÈñ¸Á