[Responsibilities] PI (Process Integration) ¿£Áö´Ï¾î·Î ½ÅÁ¦Ç° °³¹ß¿¡ µû¸¥ °øÁ¤ÀÇ Quality ¸¦ ´ã´ç Act as PI engineer for technology development from pathfinding to production ramp. Drive for unified technology design rules that have been validated based on process capabilities. Ensure for each technology node a complete set of robust PCM structures and test program for process monitoring and intrinsic rel for power devices by collaborating with device team. Participate as operations representative for projects for wide band gap power products Work with Unit process/ Test/ Package engineering, and Reliability teams to develop test screens for latent defects
[Requirements]
¹ÝµµÃ¼ Àü°øÁ¤¿¡¼ PI À¯°ü °æ·Â 10³â ÀÌ»óÀÚ (¼®»ç ¿ì´ë) ÈÇÕ¹° ¹ÝµµÃ¼ °³¹ß °æÇèÀÚ ¼±È£ Minimum 5+ years of hands-on experience in 8¡± fab with at least 0.25 um technology Experience with WBG (wide band gap) technologies Developed and successful ramped a technology to at least 1K wafers per a week Korea as a main work site is preferred, but will consider other work site if justified ±âº»ÀûÀÎ ¿µ¾îÈ¸È °¡´ÉÀÚ
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