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- ¹ÝµµÃ¼ ÈİøÁ¤ Operation Support
• Front °øÁ¤ : Back Lab, Saw, Die Attectch, Wire Bonding
• Back-end °øÁ¤ : Marking/Solder ball/Saw Sorter/Mold, SMT
• Chip Final Test °øÁ¤
• Bump °øÁ¤ : Wafer Back Grinding, Laser Grooving, Wafer Saw, Plating, Sputter/Desum, Photo°øÁ¤
• DPS °øÁ¤ : BSC/Marking, PnP, Packin