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Á¢¼ö±â°£ 2025.08.12 00½Ã ~ 2025.08.18 00½Ã ¸ðÁýºÐ¾ß »ý»ê/»ý»êÁ÷ (õ¾È 1°øÀå) / ¸ðÁý¿ä°­ ÂüÁ¶ °æ·Â ¹× Àοø ¹«°ü ¸í °í¿ë ÇüÅ ÀÎÅÏ ±Þ¿© Á¶°Ç ȸ»ç³»±Ô ÀÀ½Ã ÀÚ°Ý ¡á ÇʼöÁ¶°Ç - 5½Ã°£/ÀÏ, ÁÖ 5Àϱٹ« °¡´ÉÀÚ - °íµîÇб³ Á¹¾÷ ÀÌ»óÀÎ ÀÚ - ¹ÝµµÃ¼ ¼³ºñ Operation ¾÷¹«¿¡ ´ëÇÑ °ü½Éµµ°¡ ³ôÀº ÀÚ ¡á Á÷¹«³»¿ë - ¹ÝµµÃ¼ ÈİøÁ¤ Operation Support • Front °øÁ¤ : Back Lab, Saw, Die Attectch, Wire Bonding • Back-end °øÁ¤ : Marking/Solder ball/Saw Sorter/Mold, SMT • Chip Final Test °øÁ¤ • Bump °øÁ¤ : Wafer Back Grinding, Laser Grooving, Wafer Saw, Plating, Sputter/Desum, Photo°øÁ¤ • DPS °øÁ¤ : BSC/Marking, PnP, Packin