Application Engineer (3¸í) ä¿ë

¸ðÁýºÎ¹® ¹× ÀÚ°Ý¿ä°Ç

¸ðÁýºÎ¹® ´ã´ç¾÷¹« ÀÚ°Ý¿ä°Ç Àοø

Application Engineer

(3¸í)ä¿ë/õ¾È±Ù¹«

[´ã´ç¾÷¹«]

¼öÇà¾÷¹«

¡á °í°´ ¿ä±¸»çÇ× ¼öÁý¡¤»ç¾ç Á¤ÀÇ ¹× Wafer Test °øÁ¤ ÃÖÀûÈ­ Áö¿ø
¡á Áß±¹ °í°´ ±â¼ú Ä¿¹Â´ÏÄÉÀÌ¼Ç ¹× ±³À° Áö¿ø, VOC ´ëÀÀ


[±Ù¹«ºÎ¼­ ¹× Á÷±Þ/Á÷Ã¥]

    Á÷±Þ/Á÷Ã¥: °úÀå, Â÷Àå

[ÀÚ°Ý ¿ä°Ç]

¡á Memory Test À¯°æÇèÀÚ(Wafer Memory Test preference)

Wafer Test or Final Test Process ÀÌÇØ

ATE µ¿ÀÛ¿ø¸® ÀÌÇØ (Tester & Prober)

¡á Probe card °ü·Ã ¾÷¹« À¯°æÇèÀÚ(Application, Customer Service, Sales or Design)

Probe cardÀÇ ±¸Á¶, Á¾·ù ÀÌÇØ

Probe cardÀÇ Àü±âÀû Ư¼º ÀÌÇØ (Impedance, Crosstalk, Transmission line)

¡á Áß±¹¾î ȸȭ °¡´ÉÀÚ (Technical communication with customer)

¡á MS office »ç¿ë °¡´ÉÀÚ (Excel, Power Point µî) 


[¿ì´ë »çÇ×]

¡á OA(¿öµå ÇÁ·Î¼¼¼­, ½ºÇÁ·¹µå ½ÃÆ®, ÇÁ¸®Á¨Å×ÀÌ¼Ç µî) °ü·Ã ÇÁ·Î±×·¥ »ç¿ë ´É·Â º¸À¯ÀÚ

¡á ÆÀ üÁ¦¿¡¼­ÀÇ Ä¿¹Â´ÏÄÉÀÌ¼Ç ½ºÅ³ ´É·ÂÀ» º¸À¯ÇÑ ÀÚ

¡á Á¤È®ÇÏ°Ô ÀÏ Ã³¸®¸¦ ÇÒ ¼ö ÀÖ´Â ²Ä²ÄÇÑ ¼ºÇâÀ» °®Ãá ÀÚ

3 ¸í

±Ù¹«Á¶°Ç

  • °í¿ëÇüÅÂ: Á¤±ÔÁ÷(¼ö½À±â°£3°³¿ù)
  • ±Þ¿©Á¶°Ç: ¿¬ºÀÇùÀÇ

ÀüÇü´Ü°è ¹× Á¦Ãâ¼­·ù

  • ÀüÇü´Ü°è: ¼­·ùÀüÇü > ¸éÁ¢ÁøÇà > ÃÖÁ¾½É»ç > ÃÖÁ¾ÇÕ°Ý
  • Ãß°¡ Á¦Ãâ¼­·ù
    À̷¼­, ÀÚ±â¼Ò°³¼­

Á¢¼ö¹æ¹ý

ä¿ë½Ã

  • Á¢¼ö¹æ¹ý: ÀÎÅ©·çÆ® Á¢¼ö, À̸ÞÀÏ
  • Á¢¼ö¾ç½Ä: ÀÎÅ©·çÆ® À̷¼­

±âŸ À¯ÀÇ»çÇ×

  • ÀÔ»çÁö¿ø¼­ ¹× Á¦Ãâ¼­·ù¿¡ ÇãÀ§»ç½ÇÀÌ ÀÖÀ» °æ¿ì ä¿ëÀÌ Ãë¼ÒµÉ ¼ö ÀÖ½À´Ï´Ù.


00