[ÀÇ·Ú»ç]
- ¹ÝµµÃ¼ IC ¼ÒÄÏ »ý»ê±â¾÷
- Burn-in Socket, Module Socket, SSD Socket µî
- ȸ»çÀ§Ä¡/ ±Ù¹«Áö : Ãæ³² õ¾È½Ã ¼ºÏ±¸
[ä¿ë³»¿ë]
1. ä¿ëºÎ¹® :
- ½Å·Ú¼º º¸ÁõÆÀ
2. ´ã´ç¾÷¹« ;
- °³¹ß ¹× ¾ç»ê ǰÁúº¸Áõ
* NPI(New Product Introduction) ´Ü°è ǰÁú º¸Áõ [ Design for Assembly(DFA), Design for Reliability(DFR), APQP, PPAP µî ]3. ä¿ëÁ÷±Þ :
- °æ·Â¿¡ µû¶ó °áÁ¤
4. ÀÚ°Ý¿ä°Ç :
- 2³âÁ¦ ´ëÁ¹ÀÌ»ó
- ÀÎÁõ °ü·Ã ±¹Á¦ Ç¥ÁØ °ü·Ã Áö½Ä ¹× QMS °ü·Ã Áö½Ä º¸À¯
* ISO 9001, IATF 16949, ISO 14001 µî ǰÁú/ȯ°æ Ç¥ÁØ - °ü·Ã°æ·Â 15³âÀÌ»ó
- ¿ì´ë»çÇ× :
* ¹ÝµµÃ¼,µð½ºÇ÷¹ÀÌ,Á¦¾à µî ǰÁú°ü¸® °æ·Â
* ½Å·Ú¼º(Reliability)°ü·Ã Áö½Ä º¸À¯
* ÆÐŰ¡ ½Å·Ú¼º ½ÃÇè°ü·Ã»çÇ×
** MSL(Moisture Sensitivity Level)/TC(Thermal Cycling)/HTS(High Temperature Superconductor)/HAST(Highly Accelerated
Stress Test)
* Failure Analysis(F/A)¹× Root Cause ºÐ¼®
5. ȸ»çÀ§Ä¡/ ±Ù¹«Áö :
- Ãæ³² õ¾È½Ã ¼ºÏ±¸
[ÀüÇü¹æ¹ý]
- ¼·ùÀüÇü
- ¸éÁ¢ÀüÇü, ¼·ùÀüÇü ÇÕ°ÝÀÚ¿¡ ÇÑÇÏ¿© °³º° Å뺸
[Á¦Ãâ¼·ù]
- ÇѱÛÀ̷¼ : »çÁøÃ·ºÎ ¹× Èñ¸ÁÁ÷±Þ, Èñ¸Á¿¬ºÀ, ¿¬¶ôó µî ±âÀç
- Çѱ۰æ·Â ¹× ÀÚ±â¼Ò°³¼ : °æ·Â »ó¼¼ ÀÛ¼º
- MSword ÆÄÀÏ·Î ÀÛ¼º
[Áö¿ø¹æ¹ý]
- Online ½Ã½ºÅÛ Áö¿ø : Incruit
- e-Mail Áö¿ø : ******@*******.***, ******@*******.***
[±Ù¹«¿©°Ç]
- ȸ»çÀ§Ä¡/ ±Ù¹«Áö : Ãæ³² õ¾È½Ã ¼ºÏ±¸
- Á÷±Þ/ ¿¬ºÀ : ¸éÁ¢½Ã °æ·Â¿¡ µû¶ó ÇùÀÇ °áÁ¤
- ȸ»çº¹Áö : ÃÖ°í ¼öÁØ, ±â¼÷»ç Á¦°ø, Åë±Ù¹ö½º ¿î¿µ
=======================================================================
- (ÁÖ)Àâ´º½º H.R.Consulting ¼Ö·Î¸ó¼Ä¡
- "¹Ì·¡¿Í ½Å·Ú"¸¦ ¾à¼Óµå¸®´Â ÄÁ¼³ÅÏÆ® ÀÌ»ç ÀÌ Àç ÀÎ
- ÀüÈ ¿¬¶ôó : 070-7712-9378, ***-****-****
- e-Mail : jirhee°ñ¹ðÀÌjobnews.co.kr, jaeinrhee°ñ¹ðÀÌnaver.com