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[´ã´ç¾÷¹«] [Æ÷Áö¼Ç] Specialist, Marketing
[Á÷¹«³»¿ë] 1. ±â¼ú Àü¹®¼º (Technical Expertise) ¾Æ½Ã¾Æ Áö¿ª Selective Wet Etch ¹× Clean °øÁ¤¿¡ ´ëÇÑ ±â¼ú Àü¹®°¡·Î¼ »ç¾÷ ¿î¿µ Áö¿ø. °í°´ Æò°¡(Customer Evaluation)¸¦ ÁÖµµÇϸç, °í°´ÀÇ ±¸¸Å µ¿±â ¹× ±â¼ú ¿ä±¸¿Í ÀÏÄ¡Çϵµ·Ï Á¤È®Çϰí Àü¹®ÀûÀ¸·Î ¼öÇà.
2. ¸ÅÃâ ¹× ½ÃÀå È®´ë (Revenue and Market Growth) ¾Æ½Ã¾Æ Áö¿ª¿¡¼ EntegrisÀÇ SPI ¼ÒÀç ¼Ö·ç¼Ç ¸ÅÃâ ¼ºÀå ¹× ½ÃÀå Á¡À¯À² È®´ë¸¦ À§ÇÑ Àü·« °³¹ß ¹× ½ÇÇà.
3. ±â¼ú Áö¿ø ¹× Çù¾÷ (Technical Support and Collaboration) °í°´»ç Á¦Ç° ÀÎÁõ(Customer Qualification) °úÁ¤¿¡¼ ±â¼ú ¹× ÀÀ¿ë Áö¿ø Á¦°ø. Account Manager¿Í Çù·ÂÇÏ¿© Á¦Ç° ÇÁ·¹Á¨Å×ÀÌ¼Ç ¹× ±â¼úÀû ³íÀÇ ¼öÇà. Value Selling Process¸¦ Ȱ¿ëÇÏ¿© °í°´ ±âȸ¸¦ ¹ß±¼, °³¹ß, ¿ì¼±¼øÀ§È. Business Unit ¹× R&D ÆÀ°ú Çù·ÂÇÏ¿© Á¦Ç° ·Îµå¸ÊÀÌ °í°´ ¹× ¾÷°è ´ÏÁî¿Í Àü·«ÀûÀ¸·Î ÀÏÄ¡Çϵµ·Ï Á¶Á¤.
4. °í°´ °ü°è °ü¸® (Customer Relationship Management) °í°´ÀÇ Wet °øÁ¤ ¹× Entegris Á¦Ç° °ü·Ã µ¥ÀÌÅͺ£À̽º ±¸Ãà ¹× À¯Áö. Á¤±âÀûÀÎ °í°´ ¹ÌÆÃÀ» ÅëÇØ Áö¼ÓÀûÀÎ ¿ä±¸ »çÇ×À» ÆÄ¾ÇÇϰí, Account Manager¿Í Çù¾÷ÇÏ¿© °èÁ¤ °ü¸® °èȹ(Account Plan) ¼ö¸³. Áö¿ª ³» Wet Etch ¹× Clean ±â¼ú °ü·Ã ÇÙ½É ±â¼ú ÀÚ¹®(Go-To Technical Resource) ¿ªÇÒ ¼öÇà.
5. ±³À° ¹× Áö½Ä °øÀ¯ (Education and Training) °í°´°ú ³»ºÎ Á÷¿ø¿¡°Ô °ü·Ã °øÁ¤ ¼Ö·ç¼Ç(Process Solution) Áö½ÄÀ» ±³À° ¹× ÀüÆÄ.
6. Á¦Ç° Æ÷Áö¼Å´× ¹× ¶óÀÌÇÁ»çÀÌŬ °ü¸® (Product Positioning and Life Cycle Management) Á¦Ç°ÀÇ Æ÷Áö¼Å´×°ú Àüü ¶óÀÌÇÁ»çÀÌŬÀ» °ü¸®ÇÏ¿© ½ÃÀå Á¡À¯À²À» À¯Áö ¹× °È.
7. ÆÀ Çù·Â ¹× ºñÁî´Ï½º ȸÀÇ (Team Collaboration and Business Meetings) SPI ¸®´õ½Ê ÆÀ°ú ÇÔ²² »ç¾÷ ¸®ºä ¹ÌÆÃ Âü¿©. Áö¿ª ¹× ±Û·Î¹ú ±âȸ °ËÅä(Local/Global Opportunity Review)¿¡¼ Áö¿ª ´ëÇ¥ ¿ªÇÒ ¼öÇà. °í°´°ú ±â¼ú ·Îµå¸Ê °ü·Ã ³íÀǸ¦ ÁÖµµÇϰí Àü·« Á¶¾ð Á¦°ø. ¿µ¾÷(Account), °ø±Þ¸Á(Supply Chain), ǰÁú(Quality) µî ÁÖ¿ä ±â´É ÆÀ°ú Çù¾÷ÇÏ¿© °í°´ ¿ä±¸»çÇ× ´ëÀÀ ¹× ¿î¿µ Áö¿ø.
[ÀÚ°Ý¿ä°Ç] 1. Çз ¹× °æ·Â (Education and Experience) ÈÇÐ, ÈÇаøÇÐ, Àç·á°øÇÐ ¶Ç´Â °øÇÐ °ü·Ã Çлç ÇÐÀ§ ÀÌ»ó. ¹ÝµµÃ¼ °øÁ¤(Fab Environment), Àåºñ °ø±Þ»ç, ¼ÒÀç °ø±Þ»ç Áß Wet Etch ¹× Clean ºÐ¾ß 10³â ÀÌ»ó °æ·Â º¸À¯ÀÚ. (¿ì´ë : ¼®»ç(Master) ¶Ç´Â ¹Ú»ç(Ph.D.) ÇÐÀ§ ¼ÒÁöÀÚ)
2. ±â¼ú ¿ª·® (Technical Skills) ÷´Ü Wafer Fab ȯ°æ(Advanced Logic, Memory Vertical/3D ±¸Á¶)¿¡¼ Wet Etch ¹× Clean °øÁ¤ °³¹ß °æÇè º¸À¯ÀÚ ¼±È£. ºÐ¼®Àû ¹®Á¦ ÇØ°á ´É·Â, Çù¾÷ Á᫐ ¸¶Àεå, ½ºÆ®·¹½º »óȲ¿¡¼ÀÇ ¾ÈÁ¤µÈ ¾÷¹« ¼öÇà ´É·Â. Ç¥¸é ºÐ¼®(Surface Analytical) ±â¼ú °æÇè º¸À¯ ½Ã ¿ì´ë.
3. ±âŸ ¿ª·® (Additional Skills) ÃÖ¼ÒÇÑÀÇ °¨µ¶ ÇÏ¿¡¼µµ ½º½º·Î ¾÷¹«¸¦ ÃßÁøÇÒ ¼ö ÀÖ´Â ÀÚ±âÁÖµµÀû ¾÷¹« ŵµ. °ÇÑ ÆÀ¿öÅ© ¹× Çù¾÷ ´É·Â Çʼö. ±â¼ú ¹ßÇ¥ÀÚ·á ÀÛ¼º ¹× ÇÁ·¹Á¨Å×ÀÌ¼Ç ¿ª·®. ³»ºÎ ¹× ¿ÜºÎ ´ë»ó ¸ðµÎ¿¡ ÀûÇÕÇÑ ¿µ¾î ÀÇ»ç¼ÒÅë ¹× ¹®¼È ´É·Â. ¿µ¾î ¸»ÇÏ±â ¹× ÇÁ·¹Á¨Å×ÀÌ¼Ç ´É·Â ¿µ¾÷ ¶Ç´Â °ü¸® °æÇè º¸À¯ÀÚ ¿ì´ë.
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