2026³â µÎ»ê±×·ì Global Talent ä¿ë(¹Ú»ç)
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[AI] Physical AI
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AI ¸®¼Ä¡, Physical AI ¿¬±¸ °³¹ß
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ÄÄÇ»ÅÍ/ÀΰøÁö´É/·Îº¿°øÇÐ/±â°è°øÇÐ/Åë°è/¼öÇÐ/»ê¾÷°øÇÐ µî °ü·Ã ºÐ¾ß Àü°ø
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¢ßµÎ»ê / ÁöÁֺι®
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[Data/º¸¾È] Data Architect
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µ¥ÀÌÅÍ Àü·«/±âȹ, ¾ÆÅ°ÅØÃ³ µðÀÚÀÎ
[Àü°ø]
ÄÄÇ»ÅÍ/ÀΰøÁö´É/Åë°è/¼öÇÐ µî °ü·Ã ºÐ¾ß Àü°ø
¼¿ï
¢ßµÎ»ê / ÁöÁֺι®
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[Data/º¸¾È] AI º¸¾È
[¼öÇà¾÷¹«]
AI À§Çù ºÐ¼® ¹× ¹æ¾î Àü·« ¼³°è
[Àü°ø]
ÄÄÇ»ÅÍ/Á¤º¸º¸È£/»ê¾÷º¸¾È µî °ü·Ã ºÐ¾ß Àü°ø
¼¿ï
¢ßµÎ»ê / µðÁöÅÐÀ̳뺣À̼ÇBU
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[AI] AI ¼Ö·ç¼Ç °³¹ß ¹× ¼ºñ½º ±âȹ/±¸Ãà
[¼öÇà¾÷¹«]
±×·ì AI °úÁ¦ ¹ß±¼ ¹× °³¹ß ÇÁ·ÎÁ§Æ® ¸®µå, AI ½Å±â¼ú °ËÅä ¹× »ç¾÷±âȹ
[Àü°ø]
ÀΰøÁö´É, ÄÄÇ»ÅÍ °øÇÐ, µ¥ÀÌÅÍ °úÇÐ, ¼ÒÇÁÆ®¿þ¾î µî ÀΰøÁö´É °ü·Ã ºÐ¾ß Àü°ø
¼¿ï
¢ßµÎ»ê / ÀüÀÚBG
0¸í
[R&D] PCB ¹× ¹ÝµµÃ¼ Advanced Packaging¿ë À¯±â ¼ÒÀç ¿¬±¸ °³¹ß
[¼öÇà¾÷¹«]
PCB¿ë °í¼º´É ȸ·Î ¼ÒÀç (CCL, Prepreg ¹× Build-up Film µî) °³¹ß
¹ÝµµÃ¼ Advanced Packaging¿ë ¼ÒÀç (2.5D/3D PKG¿ë RDL, Underfill µî) ¼ÒÀç °³¹ß
[Àü°ø]
Material Research and Polymer Engineering, Semiconductor Packaging Science and Engineering
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µÎ»ê¿¡³Êºô¸®Æ¼
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[AI] AI ÀÀ¿ë ¹× °³¹ß (Machine Vision, ±â±â ¼³°è ºÐ¾ß)
[¼öÇà¾÷¹«]
ºñÆÄ±« °Ë»ç, ¿ëÁ¢ µî »ý»ê/ǰÁúºÐ¾ß ¹× »ê¾÷¿ë ±â±â ¼³°è ÃÖÀûÈ ºÐ¾ß AI ÀÀ¿ë ¹× °³¹ß
[Àü°ø]
ÄÄÇ»ÅÍ »çÀ̾ð½º, µ¥ÀÌÅÍ »çÀ̾ð½º, ±â°è°øÇÐ, »ê¾÷°øÇÐ, Á¦¾î°øÇÐ ¹× ±âŸ À¯°ü Àü°ø
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µÎ»ê¿¡³Êºô¸®Æ¼
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[AI] AI ÀÀ¿ë ¹× °³¹ß (Àü·Âº¯È¯/Àü·Â°èÅë ºÐ¾ß)
[¼öÇà¾÷¹«]
Á¦¾î¼³°è ÃÖÀûÈ ¹× Àü·Âº¯È¯/°èÅëÇØ¼® ºÐ¾ß AI °³¹ß
[Àü°ø]
Àü±â°øÇÐ, Àü·ÂÀüÀÚ, Àü·Â°èÅë À¯°ü Àü°ø
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µÎ»ê¿¡³Êºô¸®Æ¼
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[R&D] °¡½ºÅÍºó °³¹ß (³Ã°¢/°ø·Â)
[¼öÇà¾÷¹«]
°¡½ºÅͺó Åͺó/¿¬¼Ò±â ¿À¯µ¿Çؼ® ¹× CHT ÇØ¼®, ¹ßÀü¿ë/Ç×°ø¿ë Åͺó ¹× ¿¬¼Ò±â ³Ã°¢±â¼ú °³¹ß ¹× ¼³°è
°¡½ºÅͺó ¾ÐÃà±â/¿¬¼Ò±â °ø·Â¼³°è ¹× ÇØ¼®, ¹ßÀü¿ë/Ç×°ø¿ë ÆÒ/¾ÐÃà±â ¹× ¿¬¼Ò±â °ø·Â±â¼ú °³¹ß ¹× ¼³°è
[Àü°ø]
±â°è, Ç×°ø, ¿ìÁÖ, Á¶¼±, ÀÚµ¿Â÷ µî ±â°è°è¿ À¯°ü Àü°ø
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µÎ»ê¿¡³Êºô¸®Æ¼
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[R&D] ¿øÀÚ·Â ±â±â °³¹ß
[¼öÇà¾÷¹«]
¿øÀÚ·Â ±â±â ¼³°è, ÇØ¼®, Æò°¡ ¹× °³¹ß
[Àü°ø]
±â°è, ¿øÀÚ·Â, ÀΰøÁö´É À¶ÇÕ µî ¹× ±âŸ À¯°ü Àü°ø
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µÎ»ê¿¡³Êºô¸®Æ¼
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[R&D] ¼ÒÀç±â¼ú °³¹ß (Á¤¹ÐÁÖÁ¶/Çձݼ³°è/¹Ì¼¼Á¶Á÷ Á¦¾î/½ÇÇ迪ÇÐ ºÐ¾ß)
[¼öÇà¾÷¹«]
Ãʳ»¿ÇÕ±Ý ¹× ö°è ÇÕ±ÝÀÇ Á¾ÇÕÀûÀÎ ¼ÒÀç±â¼ú ¿¬±¸ ¹× °³¹ß
[Àü°ø]
Àç·á°øÇÐ(±Ý¼Ó), ±â°è°øÇÐ, Ç×°ø¿ìÁÖ°øÇÐ ¹× ±âŸ À¯°ü Àü°ø
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[AI] Physical AI
[¼öÇà¾÷¹«]
Physical AI ¹× VLA(Vision-Language-Action) ±â¹Ý ¹«ÀÎ Àåºñ ¼Ö·ç¼Ç °³¹ß
[Àü°ø]
ÄÄÇ»ÅÍ, Àü»ê, Çϵå¿þ¾î, ¼ÒÇÁÆ®¿þ¾î, ÀΰøÁö´É, µ¥ÀÌÅÍ °úÇÐ µî °ü·Ã ºÐ¾ß Àü°ø
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µÎ»ê·Îº¸Æ½½º
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[AI] Physical AI Platform
[¼öÇà¾÷¹«]
¸ÖƼ¸ð´Þ µ¥ÀÌÅÍ(VLA, LLM, Perception) ±â¹Ý °È/¸ð¹æÇнÀ ¾Ë°í¸®Áò°ú Á¦¾î ÃÖÀûÈ ¿¬±¸ ¹× °³¹ß
[Àü°ø]
·Îº¿°øÇÐ, Àü±â/ÀüÀÚ, ÄÄÇ»ÅͰøÇÐ, Á¦¾î°øÇÐ, AI µî °ü·Ã ºÐ¾ß Àü°ø
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µÎ»ê·Îº¸Æ½½º
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[AI] AI-Data Engineering
[¼öÇà¾÷¹«]
AI Robot Control Platform ±¸Ãà¿¡ ÇÊ¿äÇÑ ·Îº¿½Ã½ºÅÛ, ÇÙ½É ºñÁî´Ï½º µ¥ÀÌÅÍ ¿¬±¸ ¹× °³¹ß
[Àü°ø]
ÄÄÇ»ÅͰøÇÐ, Àü±â/ÀüÀÚ, ·Îº¿°øÇÐ, Á¦¾î°øÇÐ, Åë°èÇÐ, »ê¾÷°øÇÐ µî °ü·Ã ºÐ¾ß Àü°ø
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µÎ»ê·Îº¸Æ½½º
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[R&D] Robotics Engineering
[¼öÇà¾÷¹«]
Cobot/HumanoidÀÇ Manipulation, Application Algorithm, Model Identification ¿¬±¸ ¹× °³¹ß
[Àü°ø]
±â°è°øÇÐ, ·Îº¿°øÇÐ, Àü±â/ÀüÀÚ, Á¦¾î°øÇÐ, ¸ÞīƮ·Î´Ð½º µî °ü·Ã ºÐ¾ß Àü°ø
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µÎ»ê·Îº¸Æ½½º
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[R&D] Robotics Mechanical Engineering
[¼öÇà¾÷¹«]
Cobot/HumanoidÀÇ Layout, System, Parts µî HW ¿¬±¸ ¹× °³¹ß
[Àü°ø]
±â°è°øÇÐ, ·Îº¿°øÇÐ, ¸ÞīƮ·Î´Ð½º µî °ü·Ã ºÐ¾ß Àü°ø
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